[PDF.34kj] Carbon Nanotubes for Interconnects: Process, Design and Applications

Carbon Nanotubes for Interconnects: Process, Design and Applications

[PDF.wz43] Carbon Nanotubes for Interconnects: Process, Design and Applications

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 | #7332821 in Books |  2016-07-09 | Original language:English | PDF # 1 |  9.21 x.81 x6.14l,.0 | File type: PDF | 333 pages

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|| |“It can be served as a single-source reference on carbon nanotubes (CNTs) for interconnects applications. … a valuable addition to a scientific library, as well as served as good introduction for CNTs in 3D IC integrations for semiconductor packag

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanot...

You can specify the type of files you want, for your device.Carbon Nanotubes for Interconnects: Process, Design and Applications   |  From Springer.Not only was the story interesting, engaging and relatable, it also teaches lessons.

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