[PDF.10gl] Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)

Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)

[PDF.ig53] Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)

Design and Modeling for  Madhavan Swaminathan, Ki Jin Han epub
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 | #3944891 in Books |  2014-01-05 | Original language:English | PDF # 1 |  9.00 x1.00 x6.00l,1.45 | File type: PDF | 380 pages

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||0 of 0 people found the following review helpful.| Useless|By Srikumar Sandeep|Do not buy this useless book. Most of the derivations are completely omitted to keep the theory obscure. This book is just a copy of the second author's PhD thesis. It is also an advertisement for a startup company which came out of this work. So basically they want to publish a book without helping the academic community.|From the Inside Flap|3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspe

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The au...

You easily download any file type for your gadget.Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)   |  Madhavan Swaminathan, Ki Jin Han. A good, fresh read, highly recommended.

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