[PDF.42ob] Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

[PDF.sg64] Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

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 | #5310295 in Books |  Springer |  2012-09-23 | Original language:English | PDF # 1 |  9.25 x.21 x6.10l,.40 | File type: PDF | 76 pages

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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connecto...

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